General specification for RF PCB in Cojoin Layer Count 2 – 20 layers Board thickness 0.15-3.0mm Laminate type Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled Finished Copper weight 18-210um Metal core thickness 0.4-2mm post bonded Max panel size 610*580MM Min trace width/spacing 3/3mil(0.075/0.075mm) Minimum mechanical drill 0.15mm Surface treatment HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver