Layer Count

2   layers

Board thickness

0.15-3.20mm

Laminate type

CEM3,FR4,FR5(ISOLA,KB,NANYA,SHENGYI,ITEQ,ILM   and TUC)

Finished copper   thickness

18μm   – 210μm, advanced 1050μm / 30oz

Min finished through   hole size

0.15mm(6mil)

Max panel size

500*1500mm

Min trace   width/spacing

3/3mil(0.075/0.075mm)   based on 1/2oz and 1oz thick copper

Min width of solder   mask bridge

Base copper≤1 oz: 4mil(Green),   5mil(Other color), 8mil( on copper area)Base copper2 oz-4 oz: 6mil, 8mil( on   copper area)

Min drill size

0.2mm

Surface treatment

HASL Lead free,ENIG(AU:0.025-0.125UM,NI:2-12UM),

Immersion Tin(TIN:0.8UM-1.2UM),Immersion silver(SILVER:0.1UM-0.3UM),OSP、Hard gold(AU:0.1UM-2UM)、ENIG+OSP,

ENIG+Gold finger(AU:0.025-1.5UM,NI:2-12UM),

Hard gold+Goldfinger,Immersion silver+Goldfinger,Immersion Tin+Gold   finger,Flash Gold,Peelable mask,Carbon ink