Layer Count

4-32   layers

Board thickness

0.40-6.0mm

Laminate type

High   performance FR4, halogen-free FR4, low loss and low Dk materials

Max base copper   thickness

6oz(inner   layer),6oz(out layer)

Min finished through   hole size

0.15mm(6mil)

Max panel size

508*610mm

Min trace   width/spacing

3/3mil(0.075/0.075mm)   based on 1/2oz and 1oz thick copper

Min width of solder   mask bridge

Base copper≤1 oz: 4mil(Green),   5mil(Other color), 8mil( on copper area)Base copper2 oz-4 oz: 6mil, 8mil( on   copper area)

Min drill size

0.2mm

Surface treatment

HASL Lead free,ENIG(AU:0.025-0.125UM,NI:2-12UM),

Immersion Tin(TIN:0.8UM-1.2UM)、Immersion   silver(SILVER:0.1UM-0.3UM)、OSP、Hard gold(AU:0.1UM-2UM)、ENIG+OSP,ENIG+Gold   finger(AU:0.025-1.5UM,NI:2-12UM),Hard gold+Goldfinger,Immersion   silver+Goldfinger,Immersion Tin+Gold finger,Flash Gold,Peelable mask,Carbon   ink